The Chinese smartphone maker Huawei has finally announced its high-end HiSilicon Kirin 950 SoC, designed for various mobile devices. The chip has been in the news for months now and we reported on it some time ago.
The Kirin 950 is clearly a high-end chip – it is based on the big.LITTLE architecture and includes four Cortex-A72 cores at 2.53 GHz for demanding tasks and four Cortex-A53 cores at 1.8 GHz for less demanding applications. Next to these cores there’s another chip called i5, which is there to process the information that comes from various sensors. The Kirin 950 has Mali T880MP4 graphics inside and gets assisted by a dual-channeled LPDDR4 memory controller. In addition to this the SoC has support for 802.11ac Wi-Fi, Bluetooth 4.2, NFC and LTE Cat. 6 as well as some connectivity options such as USB 3.0, UFS 2.0, eMMC 5.1 and SD 4.1.
The Kirin 950 is made using 16 nm FinFET process by TSMC. The chip should be in various mobile devices by the end of the year.
Source: Anandtech.com