Kingston Technology Company, Inc., the independent world leader in memory products, announced the release of its first XMP-ready HyperX(R) DDR3 SO-DIMMs for notebook PCs using Intel’s Cantiga mobile chipset.
The 1066MHz CL5 Kingston(R) ultra-low latency memory kits have passed Intel’s XMP certification process and come pre-programmed with both JEDEC and XMP profiles.
“Kingston worked closely with Intel to certify the new HyperX SO-DIMM memory for new DDR3 XMP-supported, Intel(R) Centrino(TM) 2 Processor Technology systems,” said Erik Reid, Director of Marketing for Intel’s Mobile Platforms Group. “We laud Kingston’s efforts in the area of extreme mobile performance and expect that PC gamers will love the way XMP delivers next-generation notebook PCs with unrivaled performance.”
“The HyperX DDR3 XMP SO-DIMMs were tested on the Flextronics W840 DI notebook PCs with great success,” said Mark Tekunoff, senior technology manager, Kingston. “DDR3 notebook users can now enjoy the same benefits such as lower latencies and voltages that enthusiasts and gamers have had for years with HyperX memory for desktop computers.”
HyperX is backed by a lifetime warranty and free 24/7 technical support. For detailed information please visit the Kingston Web site at www.kingston.com
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Kingston HyperX DDR3 XMP SO-DIMM Specifications |
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| Part Number | Capacity and Features | MSRP (U.S. only). |
| KHX8500S3ULK2/4GX | 4GB 1066MHz Ultra-low latency (CL5-5-5-15 @ 1.5v) kit of 2 | $ 212.00 |
Source: Kingston
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